The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8536003 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 17, 2013

Filed:

Aug. 17, 2011
Applicants:

Yung-fa Lin, Hsinchu, TW;

Shou-yi Hsu, Hsinchu County, TW;

Yi-lin Sun, Hsinchu, TW;

Inventors:

Yung-Fa Lin, Hsinchu, TW;

Shou-Yi Hsu, Hsinchu County, TW;

Yi-Lin Sun, Hsinchu, TW;

Assignee:

Anpec Electronics Corporation, Hsinchu Science Park, Hsin-Chu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for fabricating a semiconductor power device includes the following steps. First, a substrate having thereon at least a semiconductor layer and a pad layer is provided. Then, at least a trench is etched into the pad layer and the semiconductor layer followed by depositing a dopant source layer in the trench and on the pad layer. A process is carried out thermally driving in dopants of the dopant source layer into the semiconductor layer. A rapid thermal process is performed to mend defects in the dopant source layer and defects between the dopant source layer and the semiconductor layer. Finally, a polishing process is performed to remove the dopant source layer from a surface of the pad layer.


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