The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2013

Filed:

Mar. 15, 2010
Applicant:

Daisuke Nakamura, Nagoya, JP;

Inventor:

Daisuke Nakamura, Nagoya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B28B 1/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for producing a high temperature-resistant article comprises an assembling step of foaming an assembly of a first substrate and a second substrate with an adhesive layer interposed therebetween and comprising paste of powder of at least one carbide of niobium carbide, hafnium carbide, tantalum carbide and tungsten carbide; and a bonding step of heating the assembly to bond the first substrate and the second substrate by sintering, thereby obtaining a high temperature-resistant article comprising the assembly after sintering. Moreover, a method for producing a high temperature-resistant article comprises a coating step of coating a slurry comprising powder of at least one carbide of niobium carbide, hafnium carbide, tantalum carbide and tungsten carbide on a surface of a high temperature-resistant substrate; a drying step of drying the substrate after the coating step; and a film-forming step of heating the substrate after the drying step to form a carbide coating film on the surface of the substrate by sintering, thereby obtaining a high temperature-resistant article having the carbide coating film. A high temperature-resistant article of a complicated shape can be easily produced at low costs by these methods.


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