The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2013
Filed:
Mar. 31, 2010
Applicants:
Mostafa Naguib Abdulla, Rancho Cordova, CA (US);
Steven Eskildsen, Folsom, CA (US);
Inventors:
Mostafa Naguib Abdulla, Rancho Cordova, CA (US);
Steven Eskildsen, Folsom, CA (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
Embodiments disclosed herein may relate to supply voltage or ground connections for integrated circuit devices. As one example, two or more supply voltage bond pads on an integrated circuit die may be connected together via one or more electrically conductive interconnects.
Quick Actions:
Abdulla, Mostafa. (2013). Supply voltage or ground connections including bond pad interconnects for integrated circuit device (U.S. Patent No. 8531849). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8531849
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile