The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2013
Filed:
Dec. 14, 2010
Applicant:
Takuya Kurosawa, Nagano, JP;
Inventor:
Takuya Kurosawa, Nagano, JP;
Assignee:
Shinko Electric Industries Co., Ltd., Nagano-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
A heat-radiating component is bonded via a thermal interface material (TIM) to an electronic component (chip) mounted on a wiring board. The heat-radiating component includes a plate-like portion thermally bonded to the chip through the TIM, and a foot portion formed on a surface which faces the electronic component, of the plate-like portion. The foot portion is formed in a ring shape at a position which surrounds a region corresponding to a mounting area of the electronic component, on the inner side of the periphery of the plate-like portion.