The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2013
Filed:
Mar. 28, 2007
Yoshikazu Oshika, Chiyoda-ku, JP;
Munenori Hashimoto, Chiyoda-ku, JP;
Masayuki Nakano, Chiyoda-ku, JP;
Yoshikazu Oshika, Chiyoda-ku, JP;
Munenori Hashimoto, Chiyoda-ku, JP;
Masayuki Nakano, Chiyoda-ku, JP;
Dowa Electronics Materials Co., Ltd., Tokyo, JP;
Abstract
A solder layer, a substrate for device joining utilizing the same and a method of manufacturing the substrate are provided whereby the device joined remains thermally unaffected, an initial bonding strength in solder joint is enhanced and the device can be soldered reliably. The solder layer formed on a base substrate () consists of a plurality of layers () of a solder free from lead, which are different in its phase from one another. They are constituted by a layer of a phase that is completely melted, and a layer of a phase that is not completely melted at a temperature not less than a eutectic temperature of the solder. The solder layer () can be applied to a device joining substrate () comprising an electrode layer () formed on the base substrate () and the solder layer () formed on the electrode layer.