The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2013

Filed:

May. 14, 2012
Applicant:

Tatsuhiko Miura, Kanagawa, JP;

Inventor:

Tatsuhiko Miura, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/46 (2006.01); H01L 21/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

In the manufacturing steps of a power-type semiconductor device, after grinding the back surface of the semiconductor wafer, when a metal film is deposited by sputtering deposition over the back surface of the wafer in a preheated state, the wafer is contained in an annular susceptor, and processed. A radial vertical cross section of the annular shape of the susceptor has a first upper surface closer to a horizontal surface for holding a peripheral portion of the top surface of the semiconductor wafer against gravity, and a second upper surface continued to and located outside the first upper surface and closer to a vertical surface for holding a side surface of the semiconductor wafer against lateral displacement.


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Miura, Tatsuhiko. (2013). Method of manufacturing semiconductor device (U.S. Patent No. 8513094). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8513094

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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