The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2013

Filed:

Aug. 09, 2007
Applicants:

Lawrence A. Clevenger, LaGrangeville, NY (US);

Timothy J. Dalton, Ridgefield, CT (US);

Elbert E. Huang, Carmel, NY (US);

Sampath Purushothaman, Yorktown Heights, NY (US);

Carl J. Radens, LaGrangeville, NY (US);

Inventors:

Lawrence A. Clevenger, LaGrangeville, NY (US);

Timothy J. Dalton, Ridgefield, CT (US);

Elbert E. Huang, Carmel, NY (US);

Sampath Purushothaman, Yorktown Heights, NY (US);

Carl J. Radens, LaGrangeville, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

Dielectric composite structures comprising interfaces possessing nanometer scale corrugated interfaces in interconnect stack provide enhances adhesion strength and interfacial fracture toughness. Composite structures further comprising corrugated adhesion promoter layers to further increase intrinsic interfacial adhesion are also described. Methods to form the nanometer scale corrugated interfaces for enabling these structures using self assembling polymer systems and pattern transfer process are also described.


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