The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2013

Filed:

Oct. 20, 2010
Applicants:

Wataru Tsukada, Tokyo, JP;

Shiro Harashima, Tokyo, JP;

Yoji Nishio, Tokyo, JP;

Inventors:

Wataru Tsukada, Tokyo, JP;

Shiro Harashima, Tokyo, JP;

Yoji Nishio, Tokyo, JP;

Assignee:

Elpida Memory, Inc., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11C 29/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Regular chip packages that store user data therein and error-correction chip packages that store an error correction code therein are mounted on a module substrate. The module substrate has first and second mounting areas of different coordinates in an X direction, and the second mounting area has third and fourth mounting areas of different Y coordinates. The regular packages are oppositely arranged in the first mounting area on a surface and the back surface of the module substrate. The error-correction chip packages are oppositely arranged in the third mounting area on the surface and the back surface of the module substrate. A memory buffer that buffers user data and an error correction code is arranged in the fourth mounting area.


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