The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8507805 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 13, 2013

Filed:

Jan. 30, 2009
Applicant:

Seiya Fujii, Tokyo, JP;

Inventor:

Seiya Fujii, Tokyo, JP;

Assignee:

Elpida Memory, Inc., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 21/561 (2013.01);
Abstract

In a wiring board according to the present invention, a substrate, a solder resist provided on the substrate, a land, a wiring line, and a connection portion connecting the wiring line and the land, the connection portion is provided with a recess as a non-flat portion, and is formed to comprise a width greater than a width of the wiring line and smaller than a width (diameter) of the land, the width of the connection portion being gradually increased from the wiring line toward the land.


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