The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2013

Filed:

Jun. 05, 2009
Applicants:

Hayato Ooishi, Chuo-ku, JP;

Kazuhiko Matsuki, Chuo-ku, JP;

Inventors:

Hayato Ooishi, Chuo-ku, JP;

Kazuhiko Matsuki, Chuo-ku, JP;

Assignee:

Elpida Memory, Inc., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A through-hole layout apparatus and method for reducing differences in layout density of through-holes. The through-hole layout apparatus includes an extractor, which extracts an existing through-hole from design data for a semiconductor integrated circuit, a calculator, which calculates a layout density of through-holes in a predetermined region for each through-hole extracted by the extractor, a selector, which selects a through-hole at the center of a predetermined region where the layout density is lower than a predetermined value as a target through-hole from among the through-holes extracted by the extractor and a through-hole adder, which determines a given position in a predetermined region centered on the target through-hole as a placement position at which a through-hole is to be added for each target through-hole selected by the selector.


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