The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2013
Filed:
Dec. 08, 2011
Hyung Sang Park, Kyoggi-do, KR;
Sung Soo Kim, Seoul, KR;
Sungwon Cho, Kyoung-gi-Do, KR;
STATS ChipPAC, Ltd., Singapore, SG;
Abstract
A semiconductor device includes a first carrier having a first resin disposed over the first carrier. A fabric is disposed over the first resin. A second resin is formed over the first resin and around the fabric to form an asymmetrical pre-impregnated (PPG) substrate. The first carrier is removed. A second carrier is provided and a first conductive layer is formed over the second carrier. A portion of the first conductive layer is removed. The first conductive layer is transferred from the second carrier to the first resin. The first conductive layer is oriented asymmetrically such that the first conductive layer is offset with respect to the fabric to minimize warpage. The second carrier is removed. A via is formed through the second resin and fabric to expose the first conductive layer. A second conductive layer formed in the via over the first conductive layer.