The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2013
Filed:
Mar. 31, 2011
Mariam Sadaka, Austin, TX (US);
Ionut Radu, Crolles, FR;
Didier Landru, Champ Pres Froges, FR;
Lea Di Cioccio, Saint Ismier, FR;
Mariam Sadaka, Austin, TX (US);
Ionut Radu, Crolles, FR;
Didier Landru, Champ Pres Froges, FR;
Lea Di Cioccio, Saint Ismier, FR;
Soitec, Bernin, FR;
Commissariat a l'Energie Atomique et aux Energies Alternatives, Paris, FR;
Abstract
Methods of bonding together semiconductor structures include annealing a first metal feature on a first semiconductor structure, bonding the first metal feature to a second metal feature of a second semiconductor structure to form a bonded metal structure that comprises the first metal feature and the second metal feature, and annealing the bonded metal structure. Annealing the first metal feature may comprise subjecting the first metal feature to a pre-bonding thermal budget, and annealing the bonded metal structure may comprise subjecting the bonded metal structure to a post-bonding thermal budget that is less than the pre-bonding thermal budget. Bonded semiconductor structures are fabricated using such methods.