The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2013
Filed:
Dec. 09, 2010
Dmytro Chumakov, Dresden, DE;
Michael Grillberger, Radebeul, DE;
Heike Berthold, Hirschfeld, DE;
Katrin Reiche, Goltzscha, DE;
Dmytro Chumakov, Dresden, DE;
Michael Grillberger, Radebeul, DE;
Heike Berthold, Hirschfeld, DE;
Katrin Reiche, Goltzscha, DE;
GLOBALFOUNDRIES Inc., Grand Cayman, KY;
Abstract
A stress compensation region that may be appropriately positioned on a package substrate may compensate for or at least significantly reduce the thermally induced mechanical stress in a sensitive metallization system of a semiconductor die, in particular during the critical reflow process. For example, a stressor ring may be formed so as to laterally surround the chip receiving portion of the package substrate, wherein the stressor ring may efficiently compensate for the thermally induced deformation in the chip receiving portion.