The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2013
Filed:
Jan. 24, 2011
Leslie Charns, San Jose, CA (US);
Jason E. Cummings, Smithfield, NC (US);
Lukasz J. Hupka, Croton-on-Hudson, NY (US);
Dinesh R. Koli, Tarrytown, NY (US);
Tomohisa Konno, Mei, JP;
Mahadevaiyer Krishnan, Hopewell Junction, NY (US);
Michael F. Lofaro, Danbury, CT (US);
Jakub W. Nalaskowski, Yorktown Heights, NY (US);
Masahiro Noda, Mei, JP;
Dinesh K. Penigalapati, Tarrytown, NY (US);
Tatsuya Yamanaka, Mie, JP;
Leslie Charns, San Jose, CA (US);
Jason E. Cummings, Smithfield, NC (US);
Lukasz J. Hupka, Croton-on-Hudson, NY (US);
Dinesh R. Koli, Tarrytown, NY (US);
Tomohisa Konno, Mei, JP;
Mahadevaiyer Krishnan, Hopewell Junction, NY (US);
Michael F. Lofaro, Danbury, CT (US);
Jakub W. Nalaskowski, Yorktown Heights, NY (US);
Masahiro Noda, Mei, JP;
Dinesh K. Penigalapati, Tarrytown, NY (US);
Tatsuya Yamanaka, Mie, JP;
International Business Machines Corporation, Armonk, NY (US);
JRS Corporation, Tokyo, JP;
Abstract
A polishing method includes polishing, in a first polish, a wafer to remove overburden and planarize a top layer leaving a portion remaining on an underlying layer. A second polishing step includes two phases. In a first phase, the top layer is removed and the underlying layer is exposed, with a top layer to underlying layer selectivity of between about 1:1 to about 2:1 to provide a planar topography. In a second phase, residual portions of the top layer are removed from a top of the underlying layer to ensure complete exposure of an underlying layer surface.