Ftp memory device programmable and erasable at cell level

Abstract

An embodiment of non-volatile memory device integrated in a chip of semiconductor material is proposed. The memory includes at least one sector of a plurality of memory cells; each sector includes a storage region of a first type of conductivity and a further storage region of a second type of conductivity. Each memory cell includes a first region and a second region of the second type of conductivity, which are formed in the storage region for defining a storage transistor of floating gate MOS type of the first type of conductivity; the memory cell likewise includes a further first region and a further second region of the first type of conductivity, which are formed in the further storage region for defining a further storage transistor of floating gate MOS type of the second type of conductivity. The memory cell also includes a common floating gate of the storage transistor and the further storage transistor. The memory device further includes programming means for programming each memory cell individually by programming the corresponding floating gate through the corresponding storage transistor, and erasing means for erasing each memory cell individually by erasing the corresponding floating gate through the corresponding further storage transistor.