The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2013
Filed:
Jan. 26, 2012
Michael A. Gaynes, Yorktown Heights, NY (US);
Rajneesh Kumar, Hopewell Junction, NY (US);
Thomas E. Lombardi, Hopewell Junction, NY (US);
Steve Ostrander, Hopewell Junction, NY (US);
Michael A. Gaynes, Yorktown Heights, NY (US);
Rajneesh Kumar, Hopewell Junction, NY (US);
Thomas E. Lombardi, Hopewell Junction, NY (US);
Steve Ostrander, Hopewell Junction, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of fabricating a chip package is provided. The chip package includes a laminate, a chip and conductive elements interposed between the chip and the laminate by which signals are transmitted among the chip and the laminate. The method includes dispensing a first underfill in a space defined between opposing faces of the chip and the laminate and dispensing a second underfill at least at a portion of an edge of the chip, the second underfill including a high aspect ratio material.