The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2013

Filed:

Mar. 14, 2012
Applicants:

Franck Lamouroux, Le Taillan Medoc, FR;

Sébastien Bertrand, Moulis-en-Medoc, FR;

Stéphane Goujard, Erignac, FR;

Alain Caillaud, Saint Caprais de Bordeaux, FR;

Francis Bagilet, Tresses, FR;

Stéphane Mazereau, Saint Aubin de Medoc, FR;

Inventors:

Franck Lamouroux, Le Taillan Medoc, FR;

Sébastien Bertrand, Moulis-en-Medoc, FR;

Stéphane Goujard, Erignac, FR;

Alain Caillaud, Saint Caprais de Bordeaux, FR;

Francis Bagilet, Tresses, FR;

Stéphane Mazereau, Saint Aubin de Medoc, FR;

Assignee:

Snecma Propulsion Solide, Le Haillan Cedex, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

To densify thin porous substrates () by chemical vapor infiltration, the invention proposes using loading tooling () comprising a tubular duct () disposed between first and second plates () and around which the thin substrates for densification are disposed radially. The tooling as loaded in this way is then placed inside a reaction chamber () in an infiltration oven having a reactive gas admission inlet () connected to the tubular duct () to enable a reactive gas to be admitted into the duct which distributes the gas along the main faces on the substrates () in a flow direction that is essentially radial. The reactive gas can also flow in the opposite direction, i.e. it can be admitted into the tooling () from its outer envelope () and can be removed via the duct ().


Find Patent Forward Citations

Loading…