The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2013
Filed:
May. 07, 2012
Steven A. Miller, Canton, MA (US);
Olaf Schmidt-park, Needham, MA (US);
Prabhat Kumar, Framingham, MA (US);
Richard Wu, Chelmsford, MA (US);
Shuwei Sun, Framingham, MA (US);
Stefan Zimmerman, Laufenburg, DE;
Steven A. Miller, Canton, MA (US);
Olaf Schmidt-Park, Needham, MA (US);
Prabhat Kumar, Framingham, MA (US);
Richard Wu, Chelmsford, MA (US);
Shuwei Sun, Framingham, MA (US);
Stefan Zimmerman, Laufenburg, DE;
H.C. Starck Inc., Newton, MA (US);
Abstract
In various embodiments, a sputtering target initially formed by ingot metallurgy or powder metallurgy and comprising a sputtering-target material is provided, the sputtering-target material (i) comprising a refractory metal, (ii) defining a recessed furrow therein, and (iii) having a first grain size and a first crystalline microstructure. A powder is spray-deposited within the furrow to form a layer therein, the layer (i) comprising the metal, (ii) having a second grain size finer than the first grain size, and (iii) having a second crystalline microstructure more random than the first crystalline microstructure. Spray-depositing the powder within the furrow forms a distinct boundary line between the layer and the sputtering-target material.