The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2013

Filed:

Mar. 10, 2011
Applicants:

Hitoshi Oba, Kameoka, JP;

Naoki Nishimori, Kusatsu, JP;

Akira Matsui, Joyo, JP;

Nobuharu Ishikawa, Takatsuki, JP;

Yoshihiro Yamashita, Fukuchiyama, JP;

Takahiro Suga, Joyo, JP;

Kosuke Sugiyama, Nantan, JP;

Inventors:

Hitoshi Oba, Kameoka, JP;

Naoki Nishimori, Kusatsu, JP;

Akira Matsui, Joyo, JP;

Nobuharu Ishikawa, Takatsuki, JP;

Yoshihiro Yamashita, Fukuchiyama, JP;

Takahiro Suga, Joyo, JP;

Kosuke Sugiyama, Nantan, JP;

Assignee:

OMRON Corporation, Kyoto-shi, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F21S 8/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

To provide a method for manufacturing a plurality of types of illuminating devices having different specifications while reducing cost. A substrate includes a common flexible portion and a plurality of units bendable with respect to the common portion, where the common portion includes a pad that is extended in the horizontal direction in the plane of the drawing and that is arranged for every predefined interval. In the present manufacturing method, a substrate piece is created by cutting the substrate mounted with the light emitting element in a first direction, the common portion in the substrate piece is formed according to the illuminating device to be manufactured, the relative position of the individual portion with respect to the formed common portion is respectively positioned, and the wiring for supplying power to the pad in the substrate piece is formed.


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