The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2013
Filed:
Aug. 25, 2011
Shunichiro Hirosawa, Ota-Ku, JP;
Shunichiro Hirosawa, Ota-Ku, JP;
Disco Corporation, Tokyo, JP;
Abstract
A wafer having a device region and a peripheral surplus region surrounding the device region is divided into individual devices. The back side of the device region is ground to form an annular reinforcement part on the outer peripheral side thereof. A dicing tape is adhered to the back side of the wafer, and the wafer is irradiated with a laser beam from the face side so as to divide the wafer into the devices and to form break starting points in the annular reinforcement part. The dicing tape is expanded so as to disassemble the annular reinforcement part, with the break starting points as starting points, thereby separating the annular reinforcement part from the device region, and widening the interval between the adjacent devices. Since the annular reinforcement part is intact when the wafer is divided, handleability during the divided process is not spoiled.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile