The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2013
Filed:
Oct. 26, 2011
Chia-chun Cheng, New Taipei, TW;
Lei-lei Liu, New Taipei, TW;
Chia-Chun Cheng, New Taipei, TW;
Lei-Lei Liu, New Taipei, TW;
Cooler Master Co., Ltd., Zhonghe Dist., New Taipei, TW;
Abstract
A heat dissipating module includes a first heat conducting plate, a second heat conducting plate and at least one heat pipe. The second heat conducting plate is disposed opposite to the first heat conducting plate. Each of the at least one heat pipe includes a first fixing portion, a first curved portion, a second fixing portion, a second curved portion and a connecting portion. The first fixing portion is positioned on the first heat conducting plate and the second fixing portion is positioned on the second heat conducting plate. The first curved portion is curved and extended from the first fixing portion. The second curved portion is curved and extended from the second fixing portion. The connecting portion is connected between the first curved portion and the second curved portion. At least parts of the first curved portion and at least parts of the second curved portion are not coplanar.