The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2013
Filed:
Aug. 03, 2006
Kazuo Nishi, Kofu, JP;
Hiroki Adachi, Kai, JP;
Naoto Kusumoto, Isehara, JP;
Yuusuke Sugawara, Minami-alps, JP;
Hidekazu Takahashi, Isehara, JP;
Daiki Yamada, Isehara, JP;
Yoshikazu Hiura, Minami-alps, JP;
Kazuo Nishi, Kofu, JP;
Hiroki Adachi, Kai, JP;
Naoto Kusumoto, Isehara, JP;
Yuusuke Sugawara, Minami-alps, JP;
Hidekazu Takahashi, Isehara, JP;
Daiki Yamada, Isehara, JP;
Yoshikazu Hiura, Minami-alps, JP;
Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;
Abstract
The present invention provides a semiconductor device having a structure that can be mounted on a wiring substrate, as for the semiconductor device formed over a thin film-thickness substrate, a film-shaped substrate, or a sheet-like substrate. In addition, the present invention provides a method for manufacturing a semiconductor device that is capable of raising a reliability of mounting on a wiring substrate. One feature of the present invention is to bond a semiconductor element formed on a substrate having isolation to a member that a conductive film is formed via a medium having an anisotropic conductivity.