The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2013

Filed:

Aug. 20, 2007
Applicants:

Yusuke Horiguchi, Toyama, JP;

Tetsuya Shinjo, Toyama, JP;

Satoshi Takei, Toyama, JP;

Inventors:

Yusuke Horiguchi, Toyama, JP;

Tetsuya Shinjo, Toyama, JP;

Satoshi Takei, Toyama, JP;

Assignee:

Nissan Chemical Industries, Ltd., Chiyoda-Ku, Tokyo, unknown;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/11 (2006.01); G03F 7/20 (2006.01); G03F 7/004 (2006.01); C08L 71/00 (2006.01); C09D 5/32 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
Abstract

To provide a resist underlayer film forming composition for lithography that is used in a lithography process for production of a semiconductor device. There is provided a resist underlayer film forming composition used in a lithography process for production of a semiconductor device, comprising a resin (A), a liquid additive (B) and a solvent (C). The liquid additive (B) may be an aliphatic polyether compound. The liquid additive (B) may be a polyether polyol, polyglycidyl ether or a combination thereof. Further, there is provided a method of manufacturing a semiconductor device, including the steps of forming a resist underlayer film by applying the resist underlayer film forming composition on a semiconductor substrate and by calcining the composition; forming a photoresist layer on the underlayer film; exposing the semiconductor substrate coated with the resist underlayer film and the photoresist layer to light; and developing the photoresist layer after the exposure to light.


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