The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8479578 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 09, 2013

Filed:

Nov. 04, 2010
Applicants:

Holm Geisler, Dresden, DE;

Matthias Lehr, Dresden, DE;

Frank Kuechenmeister, Dresden, DE;

Michael Grillberger, R{dot over (a)}debeul, DE;

Inventors:

Holm Geisler, Dresden, DE;

Matthias Lehr, Dresden, DE;

Frank Kuechenmeister, Dresden, DE;

Michael Grillberger, R{dot over (a)}debeul, DE;

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 29/04 (2006.01); G01N 3/00 (2006.01); G01N 23/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The metallization system of complex semiconductor devices may be evaluated in terms of mechanical integrity on the basis of a measurement system and measurement procedures in which individual contact elements, such as metal pillars or solder bumps, are mechanically stimulated, while the response of the metallization system, for instance in the form of directly measured forces, is determined in order to quantitatively evaluate mechanical status of the metallization system. In this manner, the complex material systems and the mutual interactions thereof may be efficiently assessed.


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