The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2013
Filed:
Dec. 02, 2011
Tomokazu Ito, Yokohama, JP;
Hisashi Nishigaki, Yokohama, JP;
Tsukasa Kawakami, Yokohama, JP;
Haruka Narita, Yokohama, JP;
Yoji Takizawa, Yokohama, JP;
Takumi Hanada, Yokohama, JP;
Munenori Iwami, Yokohama, JP;
Tomokazu Ito, Yokohama, JP;
Hisashi Nishigaki, Yokohama, JP;
Tsukasa Kawakami, Yokohama, JP;
Haruka Narita, Yokohama, JP;
Yoji Takizawa, Yokohama, JP;
Takumi Hanada, Yokohama, JP;
Munenori Iwami, Yokohama, JP;
Shibaura Mechatronics Corporation, Kanagawa, JP;
Abstract
A resin layer formation method and device for making a resin layer uniform on a substrate before lamination or on a substrate is provided. Adhesive is coated at an inner circumference side while rotating a substrate at low speed. A first adhesive layer is formed on the surface of the substrate by rotating at high speed. A step difference section is formed around a rotation center of the substrate by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer to hardening the area. Adhesive is coated at the rotation center side from the step difference section on the substrate, and a second adhesive layer is formed on the first adhesive layer by rotating the substrate at high speed. The first adhesive layer and the second adhesive layer are integrated to form a uniform adhesive layer.