The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2013
Filed:
Dec. 21, 2006
Applicants:
Thorsten Meyer, Regensburg, DE;
Bernd Waidhas, Pettendorf, DE;
Markus Brunnbauer, Lappersdorf, DE;
Grit Sommer, Grafing, DE;
Thomas Wagner, Zirndorf, DE;
Inventors:
Thorsten Meyer, Regensburg, DE;
Bernd Waidhas, Pettendorf, DE;
Markus Brunnbauer, Lappersdorf, DE;
Grit Sommer, Grafing, DE;
Thomas Wagner, Zirndorf, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor component includes a semiconductor chip, and a passive component, with the semiconductor component including a coil as the passive component. The semiconductor chip and the passive component are embedded in a plastic encapsulation compound with connection elements to external contacts.