The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2013
Filed:
Jul. 29, 2011
Applicants:
Pawel Czubarow, Wellesley, MA (US);
Osamu Suzuki, Niigata, JP;
Toshiyuki Sato, Niigata, JP;
Kazuyoshi Yamada, Niigata, JP;
Kaori Matsumura, Niigata, JP;
Inventors:
Pawel Czubarow, Wellesley, MA (US);
Osamu Suzuki, Niigata, JP;
Toshiyuki Sato, Niigata, JP;
Kazuyoshi Yamada, Niigata, JP;
Kaori Matsumura, Niigata, JP;
Assignee:
Namics Corporation, Niigata-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 7/18 (2006.01); C08K 3/36 (2006.01); C08K 9/10 (2006.01); C08L 63/00 (2006.01); C08L 63/02 (2006.01); C08L 63/04 (2006.01); H01L 23/29 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
Abstract
A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) at least one epoxy resin, (B) at least one curing accelerator and (C) at least one acid anhydride terminated polyamic acid. The liquid epoxy resin composition provides a cured material that has an excellent adhesiveness to a semiconductor chip surface and has an excellent moisture resistance.