The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2013
Filed:
Apr. 03, 2009
John A. Rogers, Champaign, IL (US);
Tae Ho Kim, Masan, KR;
Won Mook Choi, Hwaseong, KR;
Dae Hyeong Kim, Champaign, IL (US);
Matthew Meitl, Raleigh, NC (US);
Etienne Menard, Durham, NC (US);
John Carlisle, Plainfield, IL (US);
John A. Rogers, Champaign, IL (US);
Tae Ho Kim, Masan, KR;
Won Mook Choi, Hwaseong, KR;
Dae Hyeong Kim, Champaign, IL (US);
Matthew Meitl, Raleigh, NC (US);
Etienne Menard, Durham, NC (US);
John Carlisle, Plainfield, IL (US);
Abstract
Various heat-sinked components and methods of making heat-sinked components are disclosed where diamond in thermal contact with one or more heat-generating components are capable of dissipating heat, thereby providing thermally-regulated components. Thermally conductive diamond is provided in patterns capable of providing efficient and maximum heat transfer away from components that may be susceptible to damage by elevated temperatures. The devices and methods are used to cool flexible electronics, integrated circuits and other complex electronics that tend to generate significant heat. Also provided are methods of making printable diamond patterns that can be used in a range of devices and device components.