The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2013

Filed:

Jul. 28, 2008
Applicants:

John D. Prymak, Greer, SC (US);

Chris Stolarski, Greenville, SC (US);

Alethia Melody, Simpsonville, SC (US);

Antony P. Chacko, Greer, SC (US);

Gregory J. Dunn, Arlington Heights, IL (US);

Inventors:

John D. Prymak, Greer, SC (US);

Chris Stolarski, Greenville, SC (US);

Alethia Melody, Simpsonville, SC (US);

Antony P. Chacko, Greer, SC (US);

Gregory J. Dunn, Arlington Heights, IL (US);

Assignees:

Kemet Electronics Corporation, Simpsonville, SC (US);

Motorola, Inc., Schaumburg, IL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/005 (2006.01);
U.S. Cl.
CPC ...
Abstract

A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.


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