Substrate suction apparatus and method for manufacturing the same

Abstract

Provided is a substrate suction apparatus which has a vacuum suction mechanism and an electrostatic attraction mechanism, and improves planarity of a subject to be processed by improving uniformity in vacuum suction power. A method for manufacturing such substrate suction apparatus is also provided. A substrate suction apparatus () is provided with a base board (), a dielectric body (), an electrostatic attraction mechanism () and a vacuum suction mechanism (). Specifically, the dielectric body () is composed of a downmost dielectric layer (), an intermediate dielectric layer () and a topmost dielectric layer (). The electrostatic attraction mechanism () is composed of attraction electrodes () and a direct current power supply. The vacuum suction mechanism () is composed of a groove (), a suction channel (), a porous dielectric body () and the porous attraction electrodes (). The downmost dielectric layer (), the intermediate dielectric layer () and the topmost dielectric layer () are formed by spraying ceramic particles, and the attraction electrodes () are formed by spraying tungsten particles. The average pore diameter and porosity of the downmost dielectric layer () are set maximum, and those of the topmost dielectric layer () are set minimum.