The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2013
Filed:
Jan. 26, 2010
Shigeki Tanaka, Hokkaido, JP;
Masakazu Sakano, Hokkaido, JP;
Toshiyuki Shinya, Hokkaido, JP;
Takafumi Konno, Hokkaido, JP;
Kazuaki Yoshida, Hokkaido, JP;
Takashi Sato, Hokkaido, JP;
Atsushi Fujisawa, Hokkaido, JP;
Shigeki Tanaka, Hokkaido, JP;
Masakazu Sakano, Hokkaido, JP;
Toshiyuki Shinya, Hokkaido, JP;
Takafumi Konno, Hokkaido, JP;
Kazuaki Yoshida, Hokkaido, JP;
Takashi Sato, Hokkaido, JP;
Atsushi Fujisawa, Hokkaido, JP;
Renesas Electronics Corporation, Kawasaki-shi, Kanagawa, JP;
Abstract
The reliability of a semiconductor device is prevented from being reduced. A planar shape of a sealing body is comprised of a quadrangle having a pair of first sides, and a pair of second sides crossing with the first sides. Further, it has a die pad, a controller chip (first semiconductor chip) and a sensor chip (second semiconductor chip) mounted over the die pad, and a plurality of leads arranged along the first sides of the sealing body. The controller chip and the leads are electrically coupled to each other via wires (first wires), and the sensor chip and the controller chip are electrically coupled to each other via wires (second wires). Herein, the die pad is supported by a plurality of suspending leads formed integrally with the die pad and extending from the die pad toward the first sides of the sealing body. Each of the suspending leads has an offset part.