The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2013
Filed:
Apr. 02, 2010
Wen-chung Chiang, Lujhu Township, TW;
Keng-chung Wu, Lujhu Township, TW;
Ying-chi Hsieh, Lujhu Township, TW;
Cheng-kang LU, Lujhu Township, TW;
Ming-huang Fu, Lujhu Township, TW;
Wen-Chung Chiang, Lujhu Township, TW;
Keng-Chung Wu, Lujhu Township, TW;
Ying-Chi Hsieh, Lujhu Township, TW;
Cheng-Kang Lu, Lujhu Township, TW;
Ming-Huang Fu, Lujhu Township, TW;
Tong Hsing Electronic Industries, Ltd., Taipei, TW;
Abstract
A packaging substrate device includes: a first laminate including a first ceramic substrate and a first copper pattern disposed on an upper surface of the first ceramic substrate; and a second laminate disposed over the first copper pattern and including a second ceramic substrate, a second copper pattern that is disposed on an upper surface of the second ceramic substrate, and a through hole extending through the second ceramic substrate and the second copper pattern to expose a copper portion of the first copper pattern. A light emitting semiconductor die can be mounted on the copper portion within the through hole. Efficient heat dissipation can be achieved through the first laminate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile