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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8461036 B1

PDFFull Text
Expired
Date of Patent:
Jun. 11, 2013

Filed:

Dec. 22, 2009

Multiple surface finishes for microelectronic package substrates

Applicants:

Tao Wu, Chandler, AZ (US);

Charavanakumara Gurumurthy, Gilbert, AZ (US);

Reynaldo Alberto Olmedo, Phoenix, AZ (US);

Inventors:

Tao Wu, Chandler, AZ (US);

Charavanakumara Gurumurthy, Gilbert, AZ (US);

Reynaldo Alberto Olmedo, Phoenix, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Blakely, Sokoloff, Taylor & Zafman LLP

Primary Examiner:

Fernando L Toledo

Assistant Examiner:

Victoria K Hall

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/44 (2006.01); H01L 23/00 (2006.01); H01R 43/20 (2006.01); H05K 3/10 (2006.01); C25D 5/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/00 (2013.01); H01L 21/44 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01046 (2013.01); H01L 24/06 (2013.01); H01R 43/205 (2013.01); H05K 3/108 (2013.01); C25D 5/12 (2013.01);
Abstract

Multiple surface finishes are applied to a substrate for a microelectronics package by applying a first surface finish to connection pads of a first area of the substrate, masking the first area of the substrate without masking a second area of the substrate, applying a second different surface finish to connection pads of the second area of the substrate, and removing the mask.

Find Patent Forward Citations

Wu, Tao. (2013). Multiple surface finishes for microelectronic package substrates (U.S. Patent No. 8461036). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8461036

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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