The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2013
Filed:
Apr. 18, 2011
Boguslaw A. Swedek, Cupertino, CA (US);
Bret W. Adams, Sunnyvale, CA (US);
Sanjay Rajaram, Sunnyvale, CA (US);
David A. Chan, Sunnyvale, CA (US);
Manoocher Birang, Los Gatos, CA (US);
Boguslaw A. Swedek, Cupertino, CA (US);
Bret W. Adams, Sunnyvale, CA (US);
Sanjay Rajaram, Sunnyvale, CA (US);
David A. Chan, Sunnyvale, CA (US);
Manoocher Birang, Los Gatos, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.