The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8459343 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 11, 2013

Filed:

Apr. 08, 2008
Applicants:

Jui-wen Hung, Taipei Hsien, TW;

Ching-bai Hwang, Taipei Hsien, TW;

Jie Zhang, Shenzhen, CN;

Inventors:

Jui-Wen Hung, Taipei Hsien, TW;

Ching-Bai Hwang, Taipei Hsien, TW;

Jie Zhang, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A thermal module assembly includes a first thermal module () and a second thermal module (). The first thermal module () has a fan () with an air outlet, a first heat sink () positioned at the air outlet and a first clamp portion () formed on the first heat sink (). The second thermal module () has a second heat sink () and a second clamp portion () formed on the second heat sink (). The second heat sink () is juxtaposed with the first heat sink (). The first heat sink () and the second heat sink () are combined together via engagement of the first clamp portion () and the second clamp portion () so that airflow produced by the fan () flows past the first heat sink () and the second heat sink () in order.


Find Patent Forward Citations

Hung, Jui-Wen. (2013). Thermal module assembly and heat sink assembly having at least two engageable heat sinks (U.S. Patent No. 8459343). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8459343

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