The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2013
Filed:
Sep. 17, 2009
Applicants:
Mukta G. Farooq, Hopewell Junction, NY (US);
Robert Hannon, Wappingers Falls, NY (US);
Subramanian S. Iyer, Mount Kisco, NY (US);
Inventors:
Mukta G. Farooq, Hopewell Junction, NY (US);
Robert Hannon, Wappingers Falls, NY (US);
Subramanian S. Iyer, Mount Kisco, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
Abstract
A process of forming three-dimensional (3D) die. A plurality of wafers are tested for die that pass (good die) or fail (bad die) predetermined test criteria. Two tested wafers are placed in proximity to each other. The wafers are aligned in such a manner so as to maximize the number of good die aligned between the two wafers. The two wafers are then bonded together and diced into individual stacks of bonded good die.