The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2013
Filed:
Dec. 22, 2010
Michael J. Renn, Hudson, WI (US);
Bruce H. King, Albuquerque, NM (US);
Marcelino Essien, Cedar Crest, NM (US);
Gregory J. Marquez, Albuquerque, NM (US);
Manampathy G. Giridharan, Mason, OH (US);
Jyh-cherng Sheu, Hsinchu City, TW;
Michael J. Renn, Hudson, WI (US);
Bruce H. King, Albuquerque, NM (US);
Marcelino Essien, Cedar Crest, NM (US);
Gregory J. Marquez, Albuquerque, NM (US);
Manampathy G. Giridharan, Mason, OH (US);
Jyh-Cherng Sheu, Hsinchu City, TW;
Optomec, Inc., Albuquerque, NM (US);
Abstract
Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100° C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible.