The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2013
Filed:
Jan. 29, 2008
Koji Kitagawa, Nishishirakawa, JP;
Junichi Ueno, Nishishirakawa, JP;
Syuichi Kobayashi, Nishishirakawa, JP;
Hideo Kudo, Nishishirakawa, JP;
Tadakazu Miyashita, Nagano, JP;
Atsushi Kajikura, Nagano, JP;
Yoshinobu Nishimoto, Nagano, JP;
Koji Kitagawa, Nishishirakawa, JP;
Junichi Ueno, Nishishirakawa, JP;
Syuichi Kobayashi, Nishishirakawa, JP;
Hideo Kudo, Nishishirakawa, JP;
Tadakazu Miyashita, Nagano, JP;
Atsushi Kajikura, Nagano, JP;
Yoshinobu Nishimoto, Nagano, JP;
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Fujikoshi Machinery Corp., Nagano, JP;
Abstract
Provided is a polishing apparatus comprising a lower stool (), a motor () and a speed reducer () for driving the lower stool, and a box () for covering at least the portion of the lower stool below the working action face. The polishing apparatus polishes a wafer by forcing the wafer to contact the lower stool and by rotating the lower stool. The box has its inside separated by partitions (and) into a plurality of regions, and the motor for driving the lower stool is arranged in a region other than the region containing the lower stool. The polishing apparatus can manufacture a wafer of a stable shape, irrespective of the time elapsed from the running start and the presence/absence of the stop of the polishing apparatus.