The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 04, 2013

Filed:

May. 30, 2008
Applicants:

Eiichi Iijima, Chigasaki, JP;

Muneto Hakomori, Chigasaki, JP;

Toshiharu Kurauchi, Tsukuba, JP;

Takanobu Yano, Tsukuba, JP;

Yuichi Orii, Chigasaki, JP;

Inventors:

Eiichi Iijima, Chigasaki, JP;

Muneto Hakomori, Chigasaki, JP;

Toshiharu Kurauchi, Tsukuba, JP;

Takanobu Yano, Tsukuba, JP;

Yuichi Orii, Chigasaki, JP;

Assignee:

Ulvac, Inc., Chigasaki-Shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 9/26 (2006.01); H01J 9/24 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for manufacturing a sealed panel having a first substrate and a second substrate, including: a melting step of melting a sealing material which does not contain a binder for making the sealing material into paste form; a coating step of applying the melted sealing material onto a surface of the second substrate; and a sealing step of laminating the first substrate and the second substrate via the sealing material applied onto the surface of the second substrate.


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