The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2013

Filed:

Nov. 30, 2009
Applicants:

Myung Jin Yim, Chandler, AZ (US);

Nanette Quevedo, Chandler, AZ (US);

Richard Strode, Gilbert, AZ (US);

Inventors:

Myung Jin Yim, Chandler, AZ (US);

Nanette Quevedo, Chandler, AZ (US);

Richard Strode, Gilbert, AZ (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, having a substrate or a first package, and a second package coupled to the substrate or the first package, wherein the second package includes at least one die and an underfill material disposed in a portion, but not an entirety, of an area between the package and the substrate or the first package. Other embodiments may be described and claimed.


Find Patent Forward Citations

Yim, Myung. (2013). Package including an underfill material in a portion of an area between the package and a substrate or another package (U.S. Patent No. 8451620). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8451620

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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