The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 28, 2013

Filed:

Apr. 19, 2011
Applicants:

Anchuan Wang, San Jose, CA (US);

Xiaolin Chen, San Ramon, CA (US);

Young S. Lee, San Jose, CA (US);

Inventors:

Anchuan Wang, San Jose, CA (US);

Xiaolin Chen, San Ramon, CA (US);

Young S. Lee, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 21/3205 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods of forming polysilicon layers are described. The methods include forming a high-density plasma from a silicon precursor in a substrate processing region containing the deposition substrate. The described methods produce polycrystalline films at reduced substrate temperature (e.g. <500° C.) relative to prior art techniques. The availability of a bias plasma power adjustment further enables adjustment of conformality of the formed polysilicon layer. When dopants are included in the high density plasma, they may be incorporated into the polysilicon layer in such a way that they do not require a separate activation step.

Published as:
US2012190178A1; WO2012102809A2; TW201233840A; WO2012102809A3; US8450191B2; CN103329250A; KR20130130035A; JP2014509449A;

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