The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2013
Filed:
Aug. 02, 2011
Applicant:
Paul C. Lindsey, Jr., Lafayette, CA (US);
Inventor:
Paul C. Lindsey, Jr., Lafayette, CA (US);
Assignee:
Micro Processing Technology, Inc., Lafayette, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of dividing a semiconductor wafer having a metal layer and a semiconductor material layer including the step of cutting the semiconductor material layer along scribe streets without cutting the metal layer, turning over the wafer, and cutting the metal layer along the scribe streets.
Lindsey, Jr., Paul. (2013). Method of removing back metal from an etched semiconductor scribe street (U.S. Patent No. 8450188). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8450188
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile