The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2013
Filed:
Oct. 12, 2010
Masateru Koide, Kawasaki, JP;
Daisuke Mizutani, Kawasaki, JP;
Aiichiro Inoue, Kawasaki, JP;
Hideo Yamashita, Kawasaki, JP;
Iwao Yamazaki, Kawasaki, JP;
Masayuki Kato, Kawasaki, JP;
Seiji Ueno, Yokohama, JP;
Kazuyuki Imamura, Yokohama, JP;
Masateru Koide, Kawasaki, JP;
Daisuke Mizutani, Kawasaki, JP;
Aiichiro Inoue, Kawasaki, JP;
Hideo Yamashita, Kawasaki, JP;
Iwao Yamazaki, Kawasaki, JP;
Masayuki Kato, Kawasaki, JP;
Seiji Ueno, Yokohama, JP;
Kazuyuki Imamura, Yokohama, JP;
Fujitsu Limited, Kawasaki, JP;
Fujitsu Semiconductor Limited, Yokohama, JP;
Abstract
A multi-chip module includes: a board; a wiring board disposed on the board and including a wiring pattern; and a plurality of chips disposed on the wiring board. Each of the plurality of chips is connected with at least one of the other chips, and the plurality of chips and the board are electrically connected with each other via a portion other than the wiring pattern of the wiring board.