The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2013
Filed:
Sep. 28, 2011
Method of dividing a semiconductor wafer having semiconductor and metal layers into separate devices
Applicant:
Paul C. Lindsey, Jr., Lafayette, CA (US);
Inventor:
Paul C. Lindsey, Jr., Lafayette, CA (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of dividing a semiconductor wafer having a metal layer includes removing all or substantially all of the semiconductor material in scribe streets while the wafer is supported by a support, turning over the wafer and while using a second support to support the wafer, introducing a heat energy flux into the metal layer to remove metal of the metal layer from the scribe streets.
Lindsey, Jr., Paul. (2013). Method of dividing a semiconductor wafer having semiconductor and metal layers into separate devices (U.S. Patent No. 8445361). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8445361
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile