The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2013
Filed:
Sep. 02, 2009
Daniel Boss, Lake Villa, IL (US);
Scott Qualls, Chicago, IL (US);
Terrance Z. Kaiserman, Loxahatchee, FL (US);
Keith J. Margolin, West Palm Beach, FL (US);
Michael Wassief, Boynton Beach, FL (US);
Liang Chai, Stuart, FL (US);
Daniel Boss, Lake Villa, IL (US);
Scott Qualls, Chicago, IL (US);
Terrance Z. Kaiserman, Loxahatchee, FL (US);
Keith J. Margolin, West Palm Beach, FL (US);
Michael Wassief, Boynton Beach, FL (US);
Liang Chai, Stuart, FL (US);
T-Ink, Inc., New York, NY (US);
Abstract
An electrically conductive module is provided. The module includes a panel configured to engage with one or more conductive structural elements. The module further includes conductive layers formed on or in the panel. Each conductive layer has a terminal configured to be in electrical communication with at least one of the conductive structural elements. In one embodiment of the present invention, a first terminal is configured to be in electrical communication with a first conductive structural element and a second terminal is configured to be in electrical communication with a second conductive structural element. In another embodiment of the present invention, both a first terminal and a second terminal are configured to be in electrical communication with a first conductive structural element. In this embodiment, the first and second terminals are respectively configured to be in electrical communication with first and second conductive portions of the first conductive structural element.