The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2013
Filed:
Aug. 13, 2009
Dong Hee Lee, Incheon, KR;
Min Yoo, Seoul, KR;
Dae Byoung Kang, Seoul, KR;
Bae Yong Kim, Jeollanam-do, KR;
Dong Hee Lee, Incheon, KR;
Min Yoo, Seoul, KR;
Dae Byoung Kang, Seoul, KR;
Bae Yong Kim, Jeollanam-do, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A semiconductor device has a first semiconductor die having at least one metal pillar formed along an inner perimeter and at least one bond pad formed along an outer perimeter. A second semiconductor die has at least one metal pillar. A conductive bump connects the at least one metal pillar of the first semiconductor die to the at least one metal pillar of the second semiconductor die. At least one metal dam is formed on the first semiconductor die between the at least one metal pillar of the first semiconductor die and the at least one bond pad.