The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8440066 B1

PDF
Full Text
Expired
Date of Patent:
May. 14, 2013

Filed:

Apr. 06, 2007
Applicants:

Isamu Yanada, Hirakata, JP;

Masanobu Tsujimoto, Hirakata, JP;

Inventors:

Isamu Yanada, Hirakata, JP;

Masanobu Tsujimoto, Hirakata, JP;

Assignee:

C. Uyemura & Co., Ltd., Osaka-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/60 (2006.01); C25D 3/30 (2006.01); C25D 3/32 (2006.01); C23C 16/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a tin electroplating bath containing a water-soluble tin salt, one or more substances selected from inorganic acids, organic acids and their water-soluble salts, and one or more substances selected from water-soluble tungsten salts, water-soluble molybdenum salts and water-soluble manganese salts. This tin electroplating bath enables to form a tin-plated coating film on components for electronic devices such as a chip component, crystal oscillator, bump, connector, lead frame, hoop member, semiconductor package and printed board, as a substitute for a tin-lead alloy plating material, while having high whisker suppressing effects.


Find Patent Forward Citations

Yanada, Isamu. (2013). Tin electroplating bath, tin plating film, tin electroplating method, and electronic device component (U.S. Patent No. 8440066). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8440066

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