The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 2013
Filed:
Jul. 20, 2010
Applicants:
Teruaki Chino, Nagano, JP;
Akihiko Tateiwa, Nagano, JP;
Fumimasa Katagiri, Tempe, AZ (US);
Inventors:
Assignee:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package includes a semiconductor chip; a resin part configured to cover a side surface of the semiconductor chip; and a wiring structure formed on a circuit forming surface of the semiconductor chip and a surface of the resin part being situated at the same side as the circuit forming surface, the wiring structure being electrically connected to the semiconductor chip, wherein the resin part is formed so as to cover a part of a surface of the semiconductor chip situated at an opposite side to the circuit forming surface of the semiconductor chip.