The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8436254 B1

PDF
Full Text
Expired
Date of Patent:
May. 07, 2013

Filed:

Nov. 22, 2011
Applicants:

Cheng-po Yu, Taoyuan County, TW;

Han-pei Huang, Taoyuan, TW;

Inventors:

Cheng-Po Yu, Taoyuan County, TW;

Han-Pei Huang, Taoyuan, TW;

Assignee:

Unimicron Technology Corp., Kwei-San Industrial Zone, Taoyuan, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of fabrication a circuit board structure comprising providing a circuit board main body, forming a molded, irregular plastic body having a non-plate type, stereo structure and at least one scraggy surface by encapsulating at least a portion of said circuit board main body with injection molded material, and forming a first three-dimensional circuit pattern on said molded, irregular plastic body thereby defining a three-dimensional circuit device.


Find Patent Forward Citations

Yu, Cheng-Po. (2013). Method of fabricating circuit board structure (U.S. Patent No. 8436254). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8436254

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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