The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2013
Filed:
Jun. 10, 2010
Semiconductor devices having redistribution structures and packages, and methods of forming the same
Ki-hyuk Kim, Yongin-si, KR;
Nam-seog Kim, Yongin-si, KR;
Hyun-soo Chung, Hwaseong-si, KR;
Seok-ho Kim, Bucheon-si, KR;
Myeong-soon Park, Seoul, KR;
Chang-woo Shin, Seoul, KR;
Ki-Hyuk Kim, Yongin-si, KR;
Nam-Seog Kim, Yongin-si, KR;
Hyun-Soo Chung, Hwaseong-si, KR;
Seok-Ho Kim, Bucheon-si, KR;
Myeong-Soon Park, Seoul, KR;
Chang-Woo Shin, Seoul, KR;
SAMSUNG Electronics Co., Ltd., Suwon-si, KR;
Abstract
Semiconductor devices and methods of forming the same, including forming a chip pad on a chip substrate, forming a passivation layer on the chip pad and the chip substrate, forming a first insulation layer on the passivation layer, forming a recess and a first opening in the first insulation layer, forming a second opening in the passivation layer to correspond to the first opening, forming a redistribution line in a redistribution line area of the recess, the first opening, and the second opening, forming a second insulation layer on the redistribution line and the first insulation layer, and forming an opening in the second insulation to expose a portion of the redistribution line as a redistribution pad.